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ESP 컨트롤러
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CE4050E1C0 Emerson DeltaV DCS System with 8-Width Bottom Plate

CE4050E1C0 Emerson DeltaV DCS System with 8-Width Bottom Plate

브랜드 이름: Emerson
모델 번호: CE4050E1C0
MOQ: 1
가격: Negotiations
자세한 정보
원래 장소:
미국
작업 온도 범위:
-5 ° C ~ 55 ° C
모듈 식 디자인:
여러 I/O 카드 및 컨트롤러 모듈의 통합을 지원합니다
포장 세부 사항:
새로운 원본 상자
강조하다:

Emerson DeltaV DCS system with warranty

,

DeltaV DCS system 8-width bottom plate

,

ESP controller Emerson DeltaV system

제품 설명
CE4050E1C0 Emerson DeltaV DCS System with 8-Width Bottom Plate
The Emerson CE4050E1C0 is an 8-width baseboard or controller baseboard for DeltaV DCS systems, which is part of Emerson's industrial automation product line. This product is mainly used for hardware expansion and modular installation of distributed control systems (DCS), supporting the integration of multiple I/O cards and controller modules.
Main Features
  • Modular design
    • CE4050E1C0 adopts an 8-width base plate design, which can adapt to various DeltaV system cards, such as digital input/output (DI/DO), analog input/output (AI/AO) and other modules
    • Support Plug and Play, all cards can be plugged in and out with power, making maintenance and expansion easier and reducing system downtime.
  • Compatibility
    • Suitable for DeltaV control system, can be used in conjunction with CE3008 (MQ controller), CE4000 series I/O cards (such as CE4001S2T2B7 DI input card, CE4002S1T2B5 digital output card), etc
    • Some suppliers classify it as a relay module or I/O carrier, suitable for industrial automation control scenarios.
  • Industrial grade reliability
    • Adopting redundant design, supporting 10M/100M Ethernet control network, ensuring communication stability and system high availability
    • Suitable for working environments ranging from -5°C to 55°C, with anti electromagnetic interference capability, and adaptable to complex industrial environments
  • Application scenarios
    • DCS system extension: used for automation control in industries such as petrochemicals, power, pharmaceuticals, etc.
    • Remote I/O integration: supports distributed I/O deployment, reduces wiring costs
    • Equipment upgrade and maintenance: Due to its support for hot swapping, it is suitable for non-stop maintenance and system upgrades
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